Zhending technology holding high end IC packaging carrier board intelligent manufacturing factory project signed a contract yesterday
On April 6, the signing ceremony of Zhending technology holding high end IC packaging carrier intelligent manufacturing factory project was held in Taisheng business building, Qinhuangdao Economic and Technological Development Zone. Ding Wei, deputy secretary of the municipal Party committee and mayor, attended the signing ceremony and delivered a speech. Shen Qingfang, chairman of Zhending Technology Holdings, attended the ceremony in the form of video connection.
Liu Yahong, member of the Standing Committee of the municipal Party committee and executive vice mayor, attended the ceremony. Liu Xuebin, member of the Standing Committee of the municipal Party committee and Secretary of the Party Working Committee of Qinhuangdao Economic and Technological Development Zone, presided over the signing ceremony. Su Jingwen, director of the Management Committee of Qinhuangdao Economic and Technological Development Zone, and Li dingzhuan, general manager of Zhending Technology Holdings, signed strategic cooperation agreements on behalf of the two sides.
It is understood that the total investment of high-end IC packaging carrier intelligent manufacturing factory project is expected to be 1.8 billion yuan, covering an area of 72 mu. The main product is cladding chip size level packaging carrier. It is planned to be completed and put into production by the end of 2022. After the completion of the project, it will make up for the shortcomings of domestic IC chip packaging carrier technology, effectively enhance the independent innovation ability and supply system of China’s IC industry chain, and greatly improve the self-sufficiency rate of semiconductor chip carrier.
Sanlipu plans to invest 100 million yuan to set up sanlipu optoelectronic technology
On April 7, sanlipu announced that according to its own development strategy and business planning, the company plans to invest 100 million yuan in the central community of Pingdi street, Longgang District, Shenzhen to establish a wholly-owned subsidiary, Shenzhen sanlipu Optoelectronic Technology Co., Ltd. (tentatively named “sanlipu optoelectronic technology”).
Its business scope: production and sales of polarizer, protective film and solar film, R & D and sales of optoelectronic materials, domestic commerce, material supply and marketing, import and export of goods and Technology (the above does not include the items prohibited by laws, administrative regulations and decisions of the State Council and requiring pre approval); general freight. (subject to the approval of the administrative department for Industry and Commerce)
The investment to establish a wholly-owned subsidiary is based on the overall strategic layout and future development needs of the company, which is conducive to further promote the company’s business development, improve the company’s industrial layout, promote the implementation of the company’s development strategy, continuously improve the company’s comprehensive strength, and help the company’s sustainable and healthy development.
The etching machine of China micro Corporation has entered the 5nm production line of international customers
On April 6, Yin Zhiyao, chairman and general manager of China micro Corporation, disclosed that the plasma etching equipment developed by the company has entered the customer’s 5nm production line.
Yin Zhiyao said that the company’s plasma etching equipment has been used in international first-line customers from 65nm to 14nm, 7Nm and 5nm and other advanced IC Processing and manufacturing lines and advanced packaging production lines.
Among them, the 12 inch high-end etching equipment developed by the company has been used in the most advanced production lines of international well-known customers, and has been used in the processing of several key steps in devices of 5 nm and below.
In addition, the company’s MOCVD equipment has been put into mass production in the production line of leading customers in the industry.
According to the introduction, plasma etching machine is a key equipment in chip manufacturing, which is used for micro carving on the chip. The processing accuracy of each line and deep hole is one thousandth to one thousandth of the hair diameter, and the precision control requirements are very high.
The company also confirmed this statement on the interactive platform, saying that the company’s etching equipment has indeed entered the 5 nm production line.
The price of eight inch wafer factory rose wildly, and the unit price of silicon chip broke through $1000, a ten-year high
According to Taiwan Economic Daily, the foundry capacity of wafers continues to be seriously in short supply, with 8-inch being the most scarce. The industry is frantically bidding for the capacity. Recently, a batch of 0.13 micron 8-inch capacity won the bidding price, which is as high as US $1000 per piece. It is not only more than 40% higher than the industry price after the price has been increased, but also a new high price in the past decade, highlighting the situation of 8-inch capacity in short supply.
It is understood that, according to previous news, SMIC international and other manufacturers have informed their customers that their wages will be increased from April 1, including orders that have been placed but not online.
According to the Nikkei Chinese website, TSMC has also cancelled the preferential treatment for customers from the end of 2021, which will increase the price by several percentage points in fact.
As far as the current situation is concerned, there is a serious lack of core in the world. Most of the well-known chip manufacturers, such as TSMC, Samsung Electronics, SMIC international, grofonder and Lianhua electronics, are operating at full capacity, even affecting most industries in the semiconductor and electronic fields.
Hydrofluoric acid leakage accident occurred in SK Hynix M16 plant, resulting in three people injured, but the production will not be affected
On April 7, according to foreign media reports, a chemical leakage accident occurred at a factory owned by SK Hynix, a South Korean semiconductor manufacturer, which injured three workers, but the production of semiconductor products will not be affected.
According to South Korean media reports, SK Hynix’s M16 factory in Lichuan City, South Korea, was responsible for the chemical leakage accident. The accident happened on the fifth floor of the factory and the leakage was hydrofluoric acid.
South Korean media reported that at the time of the leak, workers were inspecting the equipment on the fifth floor, and three workers were injured in the leak. Sk Hynix disclosed that the leakage accident occurred during the inspection of the equipment and will not affect the production.
Toshiba receives $200 billion privatization offer from private equity firm CVC
CVC capital partners, a global private equity firm, has proposed to privatize Toshiba, Japan’s largest semiconductor manufacturer, through a takeover offer, which is expected to cost more than $20 billion, according to reports. CVC is expected to put forward a formal proposal as early as this Wednesday, the source said.
CVC is said to be considering an offer at a 30% premium to Toshiba’s share price, which will be worth nearly 2.3 trillion yen (20.8 billion US dollars) at Tuesday’s closing price. The equity company will also consider inviting other investors to participate in the acquisition.
Toshiba shares rose sharply in the U.S. after the news of the deal, and its American Depository Receipt (ADR) rose nearly 20% to $21.50 by 2 p.m.
Subsequently, Toshiba confirmed that it had received CVC’s initial offer and said it would seriously study the offer.
Intel releases new data center chips with key selling points in security and AI computing performance
On April 7, Intel officially released its latest 10nm data center chip, the third generation scalable processor, code named “Icelake”.
According to the information provided by Intel, this new Icelake processor is aimed at cloud service providers and enterprises with edge computing and high-performance computing requirements.
According to Intel, Icelake’s performance has improved by an average of 46% over previous generation product projects on common data center workloads. The processor also adds Intel SGX (software protection extension) and Intel crypto acceleration (Intel crypto acceleration) to improve built-in security without compromising performance. In addition, through hardware and software optimization, the AI performance of Icelake is 74% higher than that of the previous generation products, and the AI reasoning performance of image classification is 1.56 times higher. This makes it suitable for AI, complex image or video analysis and edge computing integration workload. In addition, compared with AMD’s third-generation epyc7763, Intel’s data center platform has the highest performance improvement of 1.5 times under 20 common AI workloads.
Whitechapel chip developed by Google will be used in pixel6 mobile phone
On April 6, according to technology media 9to5 Google, Google’s mobile phones (including pixel6) to be launched this autumn will use its own chip, Whitechapel. It is said that Google will cooperate with Samsung to develop the chip.
In early 2020, it was first rumored that Google would develop its own Whitechapel chip. The chip, part of Google’s plan to create its own system on chip (SOC), will be used in pixel phones and chromebooks, similar to Apple’s own chips for iPhones and Macs. It is said that Google will cooperate with Samsung to develop Whitechapel, and Samsung’s exynos chip can compete with snapdragon processor in Android field.
According to reports, Whitechapel seems to have been developed by Google in conjunction with Samsung’s semiconductor systems mass integration (SLSI) department, which means that Google chips will have some similarities with Samsung’s Orion chips, such as software components.
In general, Google’s new phones this fall will not use chips made by Qualcomm, but will be built on Google’s own Whitechapel hardware platform with the assistance of Samsung.
Google declined to comment on the report.
Beyond 100GHz: Ericsson and Greek operators are trying to increase 5g backhaul capacity
Ericsson has just announced a new partnership with Deutsche Telekom and cosmote, the Greek telecom operator, aimed at significantly increasing the 5g backhaul capacity of mobile networks. The company disclosed that it has successfully proved the feasibility of using frequency bands above 100GHz in the backhaul part of 5g network. Even if it has been running in the 4 ~ 80GHz band before, it can still improve the backhaul capacity with the help of higher frequency band in the future.
During the experiment, the three companies tried to deploy W-band technology of 92 ~ 114ghz. The results show that its performance is as good as that of 70 / 80 GHz E-band.
This means that W-band technology helps the backhaul part of 5g network to carry higher capacity, and Ericsson has set a record of reaching 5.7gbps within 1.5km and 10Gbps within 1km.
Internet of things
Hololens2 industrial edition is certified to meet the stringent environmental requirements of semiconductor / pharmaceutical industries
In semiconductor, pharmaceutical and other industries, there are usually very strict requirements for the environment. Recently, Microsoft announced that hololens2 industrial edition has passed the particle emission requirements of iso14644-15 clean room and UL2 class 1 certification, and can meet the particle emission standards in highly controlled clean room environment.
In addition to industry standard ratings, the new hololens2 industrial edition supports a two-year warranty and quick replacement program. The rapid replacement program minimizes downtime and provides early replacement and rapid transportation services. Hololens2 industrial edition can now be used without modifying the space, protocol or workflow, which means it can be used even in a limited environment.
Huawei and Institute of microelectronics of Chinese Academy of Sciences disclose the patent of “neural network computing circuit, chip and system”
A few days ago, Huawei Technology Co., Ltd. and the Institute of microelectronics of the Chinese Academy of Sciences announced the patent of “neural network computing circuit, chip and system”, according to the information checked by enterprises.
The neural network computing circuit includes a first computing unit, a second computing unit and a processing circuit. The first calculation unit is used to obtain the first current according to the input terminal voltage of the first calculation unit, the output terminal voltage of the first calculation unit and the set first weight value. The second calculation unit is used for obtaining the second current according to the input terminal voltage of the second calculation unit, the output terminal voltage of the second calculation unit and the set second weight value.
The processing circuit is respectively connected with the output end of the first calculation unit and the output end of the second calculation unit, and is used to obtain the target current difference according to the first current and the second current, and obtain the output voltage indicating the target calculation result according to the target current difference, wherein the target calculation result is used to indicate the calculation result of the neuron to the input data based on the weight value of the input data Fruit.
The invention provides a neural network computing chip, which comprises a neural network computing circuit as described in the first aspect and any possible implementation mode of the first aspect; A neural network computing system is provided, including a plurality of neural network computing chips as described in the second aspect.
GAC set up chip response team to coordinate supply chain issues and explore alternative solutions for key chips
On April 7, in response to the chip supply problem, GAC group said that with the strong support of Guangdong provincial and Guangzhou municipal governments, GAC group established a chip response team to coordinate the chip supply chain problems in a timely manner, implement one point, one policy and one plan, promote the shortening of the industrial chain through multi-party linkage, and actively explore alternative solutions for the development of key chips.
“In the medium and long term, we should rely on basic innovation and independent innovation of core technology to maintain the stability of the supply chain and promote the upgrading and transformation of the industrial chain. Relying on GAC Research Institute, GAC group adheres to independent innovation and positive development, forging long supply chain board of industrial chain by independent innovation, and accelerating industrialization of innovation achievements. ” GAC group said relevant people.
GAC group previously said in the investor interaction platform that the impact of chip shortage on the company’s production is controllable in the short term and is expected to gradually ease in the second quarter.
Chuanxiaopeng self developed special chip for automatic driving, which is carried out simultaneously in China and the United States
On April 7, it was reported that Xiaopeng automobile was developing its own self driving chip. The report quoted sources as saying that the chip project of Xiaopeng automobile has been started for several months, and it has been carried out simultaneously in China and the United States. At present, the team size is less than 10 people. If it goes well, it is expected to be streamed by the end of this year or early next year.
“In 2021, we will increase R & D investment, including hardware closely related to automatic driving,” he Xiaopeng, CEO of Xiaopeng automobile, said at last year’s fourth quarter performance conference
It is understood that in North America, the leader of the chip project is Benny katibian, chief operating officer of Xiaopeng automobile North America company. Like Wu Xinzhou, vice president of automatic driving business of Xiaopeng automobile, both of them worked in Qualcomm before. After joining Xiaopeng automobile, they were responsible for hardware, architecture and system design in the automatic driving center, while maintaining the cooperation between Xiaopeng automobile, NVIDIA, Qualcomm and other chip enterprises Make a relationship.
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