If you start to contact the Internet of things, you will often hear the word wireless communication module. First, let’s talk about the concept of “module”. Module is a technical term with a very wide range. Modules in software refer to the collection of program statements that can be named separately and complete certain functions independently (i.e. the collection of program code and data structure); Hardware module refers to a system with complete functions composed of multiple components with basic functions. Everything that meets the definition can be called a module, which can be divided into communication module, positioning module, photosensitive module and so on according to different functions. The module mentioned in the Internet of things generally refers to the wireless communication module. Taiwan is used to calling the module module, which has the same meaning.

In the era of Internet of things, what should we do to connect devices for communication? Similar to the cellular network used in the telephone channel between people, Internet of things devices also have a device similar to “mobile phones” to help them send and receive signals, which is the so-called wireless communication module. It is a collection of chips and peripheral circuits required by the chip. There is no unified definition in the industry at present. The wireless communication module enables all kinds of Internet of things terminal equipment to have networking information transmission capability, and is the information entrance for all kinds of intelligent terminals to access the Internet of things.

It is a key link connecting the perception layer and the network layer of the Internet of things. All equipment data generated by the terminal of the perception layer of the Internet of things needs to be aggregated to the network layer through the wireless communication module, and then the equipment can be remotely controlled through the cloud management platform. At the same time, through data analysis, the management efficiency can be improved.


The Internet of things is a long industrial chain. There are chips in the upstream of the module and terminal applications in the downstream… So where is the value of the module? Imagine that if a device wants to “call” another device and only gives it a chip, it cannot communicate with other devices. At this time, module manufacturers need to integrate baseband chips, RF, memory chips, capacitors, resistors and other components together to assemble communication modules, so that the equipment can communicate with other equipment.

Therefore, this is the first value of the module in the IOT industry chain: hardware integration and software design, integrating a variety of communication systems, meeting the environmental requirements under different application scenarios, and greatly simplifying the work of application manufacturers.

Just as mobile phone users do not need to understand the principle of radio communication, they only need to use mobile phones foolishly, application manufacturers do not need to carry out complicated integration work by themselves. They can buy products from module manufacturers and use them directly.

In different application scenarios, the communication requirements between objects are different.

If it is a water meter, it only needs to transmit a very small amount of data, and it does not need to transmit every day; If it is a car, the amount of data it needs to transmit is much larger, and the real-time requirements of data are very high; Other equipment, such as motors in factories, street lights on the roadside and speakers at home, all have their own communication needs

Therefore, this is the second value of the module in the IOT industrial chain: the upstream of the wireless communication module is baseband chip and other production raw materials, with a high degree of standardization; The downstream is divided into various application fields, which are extremely scattered. The IOT module itself is in the intermediate link between the upstream standardized chip and the downstream decentralized vertical field, and needs to meet the specific needs of different customers and different application scenarios.

Module value summary

       The first value: hardware integration and software design integrate a variety of communication systems to meet the environmental requirements under different application scenarios, which greatly simplifies the work of application manufacturers.

       Second value: it is in the middle of the vertical field of upstream standardized chips and downstream decentralization, and needs to meet the specific needs of different customers and different application scenarios.

Wireless communication modules can generally be classified as follows according to different communication technologies:

For example, 2G module refers to the module that can access the operator’s 2G network, Nb IOT module refers to the module that can access the Nb IOT network, and so on.

Beijing miracle IOT Technology Co., Ltd. is committed to promoting the application and popularization of animal networking and providing solutions according to different scenario needs. The company has developed SIMLINK card management platform to realize ESIM chip management, provide ESIM module coverage of 2G / 4G / nb-iot, and continuously promote the application of animal networking.

Because the Internet of things is the networking of equipment terminals in all walks of life, including a variety of application scenarios. Different application scenarios require different wireless communication modules, so the application scenarios of the modules are particularly rich and the market space is also very large.

    In the Internet of things application scenario, the markets with large particles (with an annual demand of more than 10 million) mainly include smart meters, mobile payments, smart vehicles, smart grids and other fields. The growth in these areas has led the main growth of the wireless communication module market.


Leave a Reply

Your email address will not be published. Required fields are marked *