1、 Thermal conductive interface material is a kind of material widely used in IC packaging and electronic heat dissipation. It is mainly used to fill the micro gap and uneven surface produced by the contact between the two materials, reduce the thermal resistance and improve the heat dissipation performance of devices.

Thermal conductive interface material is a kind of polymer composite material with polymer as matrix and thermal conductive powder as filler. It has good thermal conductivity and mechanical properties. It is widely used between the heat dissipation source and radiator in electronic components to help form a good thermal conduction channel to reduce the thermal resistance of heat dissipation. It is a good thermal solution recognized by the industry at present.

2、 Function of thermal conductive interface material:

With the rapid development of contemporary electronic technology, the integration degree and assembly density of electronic components continue to improve, which not only provides powerful use functions, but also leads to the sharp increase of its working power consumption and calorific value. High temperature will have a harmful impact on the stability, reliability and service life of electronic components. For example, too high temperature will endanger the junction of semiconductor, damage the connection interface of circuit, increase the resistance of conductor and cause mechanical stress damage. Therefore, ensuring that the heat generated by heating electronic components can be discharged in time has become an important aspect of microelectronic product system assembly. For portable electronic products with high integration and assembly density (such as notebook computers), heat dissipation has even become the technical bottleneck of the whole product. In the field of microelectronics, a new discipline, thermal management, has been gradually developed, which specializes in the safe heat dissipation methods, heat dissipation equipment and materials of various electronic equipment.

Thermal conductive interface materials play a key role in thermal management and are an important research branch of this discipline.

The principle of use is as follows: there is a very fine uneven gap between the surface of Microelectronic Materials and the radiator. If they are directly installed together, the actual contact area between them is only 10% of the base area of the radiator, and the rest are air gaps. Because the thermal conductivity of air is only 0.025w / (m.k), it is a poor conductor of heat, which will lead to very large contact thermal resistance between electronic components and radiator, which seriously hinders heat conduction and leads to low efficiency of radiator. Fill these gaps with thermal interface materials with high thermal conductivity, remove the air, and establish an effective heat conduction channel between the electronic components and the radiator, which can greatly reduce the contact thermal resistance, give full play to the role of the radiator, ensure that the electronic devices can work within the appropriate temperature range, and ensure the normal performance of the electronic devices.

3、 Introduction to common thermal conductive interface materials:

With the increasing requirements of microelectronic products for safe heat dissipation, thermal conductive interface materials are also developing.

4、 Characteristic index of thermal conductive interface material:

Thermal conductivity: refers to that under the condition of stable heat transfer, two parallel planes with a distance of 1 meter and an area of 1 square meter are set inside the object perpendicular to the direction of heat conduction, and the temperature difference between the two planes is 1 degree. The heat transferred from one plane to another in one second is the thermal conductivity of the material. Unit: w / MK.

5、 Main testing equipment for thermal conductive interface materials:

1. The equipment used for testing are mainly thermal resistance measuring instrument and thermal conductivity measuring instrument.

2. Thermal conductivity: a physical quantity that describes the thermal conductivity of a material. It is the inherent characteristic of a single material and has nothing to do with the size and shape of the material.

3. Thermal resistance: a comprehensive parameter reflecting the ability to prevent heat transfer. In the engineering application of heat transfer, in order to meet the requirements of production technology, sometimes the heat transfer is strengthened by reducing the thermal resistance; Sometimes, the heat transfer is restrained by increasing the thermal resistance.

6、 Application examples of thermal conductive interface materials:

1. Chips (CPUs, GPUs, chipset, etc.);

2. Laptop and network server;

3. Mobile communication (base station, switch, etc.);

4. High power LED heat dissipation charging pile;

5. Power components without special insulation requirements;

6. Heat conduction between semiconductor and radiator;

7. LCD and plasma TV;

8. Heat conduction of communication products;

9. On board communication electronic equipment;

10. Set top box, handheld electronic equipment (micro projector).

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