(Electronic Enthusiast Network Report) In the past week, the chip wars in the fields of 5G, high-performance computing, and smart cars continued to burn. TSMC, Huawei, Samsung, and Intel are all working hard to expand their revenue and layout in the chip field this year. The author concentrated on three heavy pieces of information for comment.
TSMC’s market value jumps to eighth in the world! Revenue to double in 2024 compared to 2020
On January 13, TSMC, the leader of foundry industry, said that the release of its outlook surprised the market, driving ADR’s stock price to rewrite the closing high on the 13th and 14th. According to Bloomberg Market data, TSMC’s latest market value has reached 729.4 billion US dollars, regaining the The throne of the global semiconductor king, and jumped to the world’s eighth largest company by market value.
On the eve of the law meeting, a number of foreign investors have successively raised their target prices. As the operating report card and outlook released by TSMC’s law meeting were better than market expectations, more foreign investors followed suit and raised their target prices. Looking at the price of 1035 yuan, most foreign investors are optimistic that the stock price will break through the 800 yuan mark.
Foreign investors are optimistic, TSMC’s revenue in 2024 will double from 2020, and foreign investors expect that TSMC’s annual profit will exceed the trillion yuan mark by 2024.
Lily’s comment: The TSMC Fashuo meeting has two major focuses this time: First, 2022 is a year of strong growth. TSMC estimates that the global foundry industry can grow by another 20%. TSMC itself will grow at a higher rate than the industry as a whole. Growth ranges from 25% to 29%. Second, TSMC’s capital expenditure in 2022 is estimated to reach US$40 billion to US$44 billion, about 70%-80% of which are used in high-end processes 2nm, 3nm, 5nm and 7nm, about 10% are used in high-end packaging and mask manufacturing, and another 10% is used in high-end packaging and mask manufacturing. % plan to be used at 10%-20%.
Foreign media commented that these figures affirmed TSMC’s market leadership during the unprecedented chip shortage caused by the epidemic, which severely affected the production of cars, mobile phones and game consoles. With more and more connected devices, such as cars driving data centers and high-end computing, TSMC is investing heavily to maintain its technological leadership over Intel Corp. and Samsung Semiconductor in order to maintain its market share.
Huawei bets big on chip packaging technology
Recently, according to “Nikkei AsiaNews” report, people familiar with the matter revealed that China’s Huawei is actively improving its chip packaging capabilities to reduce the impact of the US government’s crackdown on the company’s lack of access to key semiconductor production technology. Huawei has partnered with display industry leader BOE Technology Group to develop panel-level chip packaging technology, which assembles chips on a display panel-like substrate instead of the usual wafer material, according to people familiar with the matter.
It is reported that Huawei has also accelerated efforts to hire expert talent from leading suppliers such as Taiwan’s ASE, the world’s top chip packaging and testing service provider.
Lily’s comment: Since Huawei was blacklisted by the US government in 2019, the capabilities of its chips have been greatly limited. HiSilicon is Huawei’s chip design department. It has launched a number of series of chips, such as Kirin, Tiangang, Kunpeng, Lingxiao, Shengteng, etc., all of which have very strong performance and support many of Huawei’s businesses. Since the beginning of this year, it is rumored in the industry that HiSilicon’s shipments have plummeted by 82%. Ren Zhengfei came forward to set the tone for HiSilicon, allowing HiSilicon to continue to climb the Himalayas, and will continue to send dry food.
Huawei is currently entering 5G, AI, smart cars, photovoltaic energy storage and other fields that require the support of semiconductor chips to meet the needs of customers. Huawei has never given up the goal of improving its chip capabilities. This is to help it become the largest in China. The core competitiveness of technology companies.
Advanced packaging technology has become a breakthrough point for many chip manufacturers. The world’s top chip makers and developers such as Intel and TSMC have begun to devote more resources to chip packaging, developing new ways of placing or stacking chips to improve performance.
Huawei is building a nationalized supply chain for chips. Overseas media revealed that Quliang Electronics, a little-known chip packaging and testing supplier in Fujian province, is rapidly expanding its production capacity in Quanzhou to help Huawei put its advanced chip assembly designs into production, and to give a boost to some of the company’s cutting-edge designs. Experiment with chip stacking technology and packaging technology.
Earlier, Huawei Consumer CEO Yu Chengdong once publicly stated that Huawei mobile phones will return to the king in 2023. I believe that the confidence behind it is HiSilicon’s breakthroughs in chip design, manufacturing and packaging. Overseas media also revealed that Huawei is working on a chipset project, which will be Huawei’s largest chipset project, and its test version may be completed by the end of 2022, we will wait and see.
This article was originally created by electronic enthusiasts, please indicate the above source for reprinting. Wechat zy1052625525. If you need to join the group for communication, please add WeChat elecfans999, and if you need to submit an interview, please send an email to [email protected]