Introduction to various PCB base plates, including 94hb, fireproof board (94vo, FR-1, FR-2), semi glass fiber (22F, CEM-1, CEM-3) and all glass fiber (FR-4).

FR-1: features: 1. Halogen free plate, which is conducive to environmental protection. 2. High leakage resistance and marking index (above 600V, special requirements shall be put forward). 3. Suitable punching temperature is 40 ~ 70 ℃. 4. Bow curvature and distortion rate are small and stable

FR-2: features: excellent leakage trace resistance (above 600V) 5. Low cost and wide application range 6. Excellent moisture and heat resistance 7. Suitable punching temperature is 40 ~ 70 ℃. 8. Bow curvature and distortion rate are small and stable 9. Superior dimensional stability

CEM-3: features: excellent machinability and punching machinability 1. The electrical performance is equivalent to FR-4, the processing process is the same as FR-4, and the wear rate of drill nozzle is lower than FR-4 2. Multi grade leakage trace resistance (CTI 175v, cti300v, cti600v) 3. It meets the specification requirements of ipc-4101a

FR-4: features: halogen free, bromine and chlorine content less than 0.09%, halogen free, br / Cl content below 0.09% 1. It does not contain antimony and red phosphorus, and there are no toxic components left during combustion, such as antimony and red phosphorus free, absence of highly toxic dioxins in burning exhaust gas 2. The sheet is harder than kb-6160

The following is the product model: paper coated copper panel

The characteristics of various types of PCB substrate materials are introduced

KB-3152 FR-1

It is an environment-friendly paper-based phenolic resin copper laminate without halogen and antimony developed for environmental protection, which can avoid toxic substances and gases produced when the combustion plate contains halogen and antimony. It has high leakage index (above 600 V) and is suitable for low temperature punching operation.

KB-3151S FR-1

It is a paper-based phenolic resin copper area laminate developed to meet the needs of precision circuit boards such as high-density automatic plug-ins and wafer part surface adhesion technology. It has excellent silver migration resistance and electrical performance in humid environment.

KB-3150/KB-3151

It is a newly developed paper-based phenolic resin copper area laminate for the needs of precision circuit boards such as high-density automatic plug-ins and wafer part surface adhesion technology. It can have high leakage index (above 600V) and is suitable for low temperature punching operation.

KB-3150 FR-1

It is a paper-based phenolic resin insulation laminate developed for precision components such as switch surface box (such as piano key switch and push switch). It has excellent flame retardant performance and dimensional stability, and is suitable for low-temperature punching processing.

KB-2151 FR-2

It is a paper-based phenolic resin copper area laminate developed to meet the needs of precision circuit boards such as high-density automatic plug-ins and wafer part surface adhesion technology.

KB-2150G/2150GC FR-2

It is an environment-friendly paper-based phenolic resin copper area laminate without halogen and antimony developed for environmental protection, which can avoid toxic substances and gases produced when the combustion plate contains halogen and antimony. It not only maintains the good performance of FR-2, but also has excellent moisture and heat resistance.

KB-150/1150/150D Unclad (ANSI:XPC)

It is a paper-based phenolic resin insulation laminate developed for the demand of precision components for mechanical transmission. It has good moisture and heat resistance, and is suitable for low temperature punching.

KB-1150/KB-1151 ANSI XPC

It is a paper-based phenolic resin copper laminate with good moisture and heat resistance, and is suitable for low-temperature punching.

The following is the product model: glass fiber copper clad panel

Semi cured sheet FR-4

Jiantao semi cured sheet is obtained by curing the E-grade glass cloth impregnated with flame retardant epoxy resin to “B” stage under accurate temperature and weight control, so that it has stable rheological properties in the manufacturing process of multilayer circuit board.

KB-7150 CEM-3

It is a composite copper clad laminate, which can replace FR-4 for single / double-sided circuit boards. It has good processability, reliability of metallized holes, moisture and heat resistance.

KB-6167 FR-4

It is an epoxy glass cloth based copper clad laminate, which has excellent heat resistance and mechanical properties. It can be used as printed circuit board requiring high density and excellent heat resistance.

KB-6165 FR-4

It is used in computers and peripheral equipment, communication equipment, instruments and meters, office automation equipment, etc.

KB-6164 FR-4

It is an epoxy glass cloth based copper clad laminate with the same performance and UV light blocking function as kb-6160. It is suitable for making printed circuit boards with UV blocking and AOI functions.

KB-6162 FR-4

It is an environment-friendly glass fiber cloth / epoxy resin based copper clad laminate without halogen, antimony, red phosphorus and other toxic components. It is used for computers, computer peripherals, mobile phones, cameras, televisions, video games, etc.

KB-6160/6160C FR-4

It is an epoxy glass cloth based copper clad laminate with UV blocking function. Other properties are equivalent to kb-6150. It is suitable for circuit boards with bidirectional simultaneous photosensitive curing solder resist ink (UV) and optical automatic inspection (AOI) requirements.

KB-6150/6160 FR-4

It is used for mobile phones, computers, testing equipment, video recorders, televisions, military equipment, guidance systems, etc.

KB-6150/6150C FR-4

It is a kind of epoxy glass cloth based copper clad laminate, which can be used as single-sided / double-sided circuit board and multilayer circuit board. It has good flame retardancy and dimensional stability.

KB-6050/606X

It is suitable for pressing multi-layer plates.

KB-5152(GB:22F)

It is used in displays, video recorders, power supply substrates, industrial instruments, digital recorders, etc.

KB-5150 CEM-1

It is a composite based copper-clad foil plate, which takes into account the good processability of paper substrate and the mechanical and dielectric properties of glass cloth substrate. It is suitable for circuit boards with high frequency and requiring punching processing.

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