The TLSR827x series SoC supports the angle-finding function of the Bluetooth LE 5.1 protocol, Bluetooth Mesh, Zigbee, and 2.4GHz proprietary protocols, and can realize multi-protocol time-sharing switching and even concurrent operation. This series of chips integrates wireless radio frequency, digital baseband processing, 32-bit MCU, memory, power management, security modules, and rich peripheral interfaces. It is an ideal single-chip solution for various low-power wireless IoT applications. With the on-chip MCU and flash memory, the TLSR827x can run complex firmware programs to implement various communication protocols and application functions. Not only that, the TLSR827x also supports firmware OTA update, which is convenient for online product upgrade and realize the latest functions.
The TLSR827x series of SoCs have industry-leading RF transceiver performance with a link budget of 106dBm. The advanced power management module makes the TLSR827x have excellent low power consumption performance, which can support battery-powered equipment to run continuously for months or even years. The chip has a very high level of integration, including a 32kHz RC oscillator circuit, RF matching inductors, and DCDC and LDO inside the chip. The expensive DCDC inductor can be omitted when choosing to power from the internal LDO. For some applications, the TLSR827x can also support PCBs using FR1 material, which further reduces the overall system BOM cost.
The TLSR827x fully supports the advanced Bluetooth 5.1 standard and can realize the AoA/AoD angle direction finding function, laying the foundation for high-precision asset tracking and positioning and navigation. The high-performance voice input and output interface integrated on the chip can realize various advanced products with voice interaction function. Through the built-in PTA interface, the chip can be used in Wi-Fi-enabled devices (routers, set-top boxes, etc.), which greatly reduces wireless signal interference and improves connection stability.
As a SoC that supports multiple wireless protocols, the TLSR827x can flexibly implement multiple operation modes by carrying various software development kits (SDKs) provided by Telink. IoT device developers can use TLSR827x to implement different software functions on the same hardware platform, such as launching a Bluetooth version or Zigbee version of the same product to meet different market demands, which greatly saves system development costs and time. Second, developers can also pre-program multi-protocol firmware on the same device, and let the end user or even the device itself decide which connection protocol to run. Furthermore, equipped with Telink multi-protocol parallel SDK, after the device is powered on, it can establish connections with other devices or networks (such as Bluetooth low energy and Zigbee) through two wireless protocols at the same time, realizing multi-protocol real-time parallel operation.
Since mass production in 2020, the TLSR827x series of SoCs have been widely used in IoT devices including smart remote controls, smart homes, location services, smart medical care, and human-computer interaction devices. In 2021, Google selected the TLSR827x chip as the reference design platform for its Google TV smart remote control, allowing global device manufacturers to use this reference design to achieve rapid time-to-market for the latest standard products.
TLSR827x series SoC main features