• Advanced ultra-thin packaging and 3D technology are the core driving force of the next generation of high-performance energy-saving design
  • High density solution, suitable for applications with limited space but requiring thinner power supply
  • Scalable and highly configurable, with multiple programmable memories, using digital communication (I2C and pmbus) to provide a wide range of flexibility
  • It will be launched at the 2022 Asia Pacific Economic and trade cooperation (APEC) conference held in Houston, Texas, from March 20 to 24. TDK booth number is 814

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March 17, 2022

TDK Corporation (TSE: 6762) announced the launch of fs1412 micropol (µ POL) ™) Power module. The size of fs1412 is 5.8mm x 4.9mm x 1.6mm, which is a new series of µ pol ™ As a part of DC-DC converter, it has higher performance, minimum available size, easy to use and simplified integration. It is suitable for applications such as big data, machine learning, artificial intelligence (AI), 5g cellular, Internet of things, telecommunications and computer enterprises. μ Pol technology includes a DC-DC converter placed near complex chipsets such as ASIC and FPGA. By shortening the distance between the converter and the chipset, the resistance and inductance elements are minimized, allowing rapid response and precise adjustment under dynamic load current. Fs1412 has started mass production in the fourth quarter of 2021.

For many years, TDK has been developing this technology to enable system level solutions to improve electrical and thermal performance, and provide high-density and cost-effective solutions for applications requiring thin power supply due to space constraints. These new solutions integrate high-performance semiconductors into advanced packaging technologies, such as semiconductor embedded substrate (sesub) and advanced electronic components, so as to realize unique system integration in smaller size and thinner shape through 3D integration. This integration allows TDK to provide higher efficiency and ease of use at the current lower total system cost.

The new µ pol DC-DC converter series can operate in a wide junction temperature range of – 40 ℃ ~ 125 ℃, and has a high current density of more than 1000 a per cubic inch. This series provides 12a current, the lowest height available on the market is 1.6mm, and provides 50% less solution size than other similar products. Therefore, it also minimizes the cost of system solution, circuit board size and assembly cost, BOM cost and PCB cost.

TDK will showcase its full range of µ pol technology and compact power solutions at the 2022 Asia Pacific Economic and trade cooperation (APEC) conference held at George Brown Convention Center in Houston, Texas, from March 20 to 24 at booth 814.


μ Pol and npol are integrated DC-DC converters placed near complex ICs such as ASIC and FPGA

Main application

  • Networked storage: enterprise SSD / storage area network
  • Servers: mainstream servers, rack and blade servers, micro servers
  • Netcom and Telecommunications: Ethernet switches and routers, 5g small cells and 5g base stations

Main features and advantages

  • Product size is 4.9 x 5.8 x 1.6 mm
  • The rated output current is 12a, and the required capacitance is 50% less than that of the existing products
  • It is applicable to the junction temperature range of – 40 ℃ ~ 125 ℃
  • Lead free and RoHS / WEEE compliant

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