How to correctly maintain PCB etching equipment

The key factor to maintain PCB etching equipment is to ensure the high-definition cleanliness and no obstruction of the nozzle, so that the nozzle can spray smoothly. Blocking or slagging will produce pressure during spraying and impact the plate surface. If the nozzle is not clean, it will cause uneven etching and waste the whole […]

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How to improve the quality of PCB etching process

1、 Foreword Purpose of etching: after the circuit is electroplated, the board removed from the electroplating equipment is processed to complete the circuit board. Specifically, there are the following steps: a. Stripping: peel off the dry film used for anti electroplating with liquid medicine. The hardened dry membrane is partially dissolved under this concentrated solution […]

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Introduction to etching process of printed circuit board PCB

1、 Overview At present, the typical process of printed circuit board (PCB) processing adopts “graphic electroplating method”. That is, a layer of lead tin corrosion resistant layer is pre plated on the copper foil to be retained on the outer layer of the board, that is, the graphic part of the circuit, and then the […]

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[Xinwen selection] the price of eight inch wafer factory soared, and the unit price of silicon wafer broke through $1000, a ten-year high; the etching machine of China micro Corporation has entered the 5nm production line of international customers

Industry newsZhending technology holding high end IC packaging carrier board intelligent manufacturing factory project signed a contract yesterdayOn April 6, the signing ceremony of Zhending technology holding high end IC packaging carrier intelligent manufacturing factory project was held in Taisheng business building, Qinhuangdao Economic and Technological Development Zone. Ding Wei, deputy secretary of the municipal […]

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What should be paid attention to in the process of PCB etching

A large number of quality problems related to the etched surface are concentrated in the etched part of the upper plate surface, and these problems come from the influence of colloidal structure produced by the etchant. It is very important to understand this, because colloidal agglomerates accumulate on the surface of copper. On the one […]

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