NXP offers a broad portfolio of tailor-made HDMI products including transmitters, interface conditioners and protectors that simplify the HDMI interface design process. This solution is optimized for fairly simple routing, provides the best ESD protection and HDMI signal conditioning mechanisms, and fits easily with Type-C and Type-D connectors.

  Program overview

HDMI is the abbreviation of "High-Definition Multimedia Interface". It is a digital video/audio interface technology. It is a dedicated digital interface suitable for image transmission. It can transmit audio and video signals at the same time. The maximum data transmission speed is 5Gbps. Digital/analog or analog/digital conversion is performed before signal transmission, and this interface technology is now widely used in mobile phones, tablet computers, DV cameras, digital cameras and other fields.

Impedance-matched (100 ohm differential) TMDS lines are critical to HDMI interface design, with the lowest line capacitance, allowing maximum eye opening for differential signaling and robust system-level ESD protection. NXP actively supports eye-opening mode testing. The authorized test center in Caen, France, provides HDMI compliance measurements (including TDR), and proposes a variety of efficient and convenient HDMI interface solutions, which are excellent in signal conditioning and ESD protection.

  functional framework

  

Low power HDMI transmitter connected to a 3 x 8 DVI, supports CED and HDCP. The transmitter is backward compatible with DVI 1.0 and can be connected to any DVI 1.0 or HDMI receiver. The HMDI ESD protection mechanism protects source and sink devices such as TVs, mobile phones, multimedia boxes and other devices from ESD and transient discharges when connected with HDMI cables.

This HDMI interface condition solution provides a simple and straightforward routing that requires almost no discrete components. These devices integrate functions such as level shifting to the voltage levels required by the HDMI interface specification and sub-µ technology SoCs for mobile devices that no longer support high voltages.

 Program features and advantages

  High system level ESD protection (IEC61000-4-2 level 4)

– The "zero clamping" concept prevents ESD pulses from being passed between SoCs.

  Fully supports hot plug detection, DDC, CEC

——Integrated horizontal transfer signal line

– Integrated pull-up resistor

– Integrated CEC sink current source

– Integrated power management saves 97% when the chip is disabled.

  Compatible with HDMI Type-C and D-type connectors

– No need to connect a Schottky diode to the CEC pin

– Fully compliant with NXP Reference Edition specifications

– Compact SOT1156 package (2.1 x 2.5 x 0.4 mm).

  Advantage:

1. Reduce time and design space

2. Direct routing (even on two-layer boards)

3. Extended battery life thanks to Auto-Eco option

4. Fewer components

There is no need to provide a dedicated power management pin for the IP4791 chip on the system microcontroller GPIO, and this feature does not support this feature. Chip enable is automatically achieved by connecting the ACTIVE pin to the HOTPLUG pin of the connector.

  

IP4791 chip connection diagram

Data details: IP4791 chip introduction and interface schematic diagram

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