Housed in a PowerPAK® 5 mm x 6 mm package, the device features built-in current and temperature monitoring for infrastructure, cloud computing, and graphics card applications.

MALVERN, Pa. — March 16, 2021 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced the availability of nine thermally enhanced 5 mm x 6 mm PowerPAK® MLP56-39 packages with integrated current and temperature New 70 A, 80 A and 100 A VRPower® Smart Power Modules with monitoring capabilities. Vishay Siliconix's SiC8xx family of smart power modules improves energy efficiency and current reporting accuracy, reducing energy costs for data center and other high-performance computing, and 5G mobile infrastructure communications applications.

The recently released power modules contain power MOSFETs and advanced driver ICs. To improve energy efficiency, the device's internal MOSFETs use advanced TrenchFET® Gen IV technology, which sets the industry benchmark for performance and significantly reduces switching and conduction losses. The peak energy efficiency of SiC8xx intelligent power modules can reach more than 93% under various application conditions. Diode emulation mode can be enabled at light loads to improve efficiency over the full load range.

The SiC8xx power modules have input voltages from 4.5 V to 21 V (as shown in the table) and switch frequencies up to 2 MHz. Fault protection features include high-side MOSFET short-circuit and overcurrent alarms, thermal protection, and undervoltage lockout (UVLO). The SiC8xx series supports 3.3 V and 5 V tri-state PWM logic levels and is compatible with various PWM controllers.

The smart power modules are sampling and mass-produced now, with lead times of 16 weeks.

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