Molex released microtpa 2.00mm wire to plate and wire to wire connector system to provide electrical and mechanical reliability in high temperature resistant design and meet the requirements of many industries. This kind of connector can be ideally used in the consumer goods market and automobile market requiring compact wire-to-wire board and wire-to-wire connector system. The rated current is up to 2.5 A, which is suitable for use in confined space.
Microtpa 2.00mm line-to-line board and line-to-line connector system have many advantages. The line-to-line connector system can provide 2 to 15 circuits and accept a wide range of wire specifications. The crimping terminal is a popular product in the market, equipped with TPA support ring and locking structure, which conforms to RoHS regulations and can well withstand high temperature, It is also designed with a vertical through-hole joint with a pitch of 2.00mm.
Mariko Okamoto, MOLEX’s global product manager, said: “the new microtpa connector system is designed to withstand harsh environmental conditions. For example, the bottom and wall frame of the connector have been raised so that the potting material can cover the entire printed circuit board, so as to prevent moisture from entering the connector and avoid some common problems in conductivity.”
Compared with similar connector systems in the current market, microtpa 2.00mm wire to plate and wire to wire connector systems provide a current of 2.5A and a temperature range of – 40 to + 105 ˚ C. The cable range is 0.85 mm to 1.50 mm.