With the continuous development and progress of the semiconductor industry, the manufacturing system is also trying its best to cater to this change, aiming to meet the challenging technical and commercial requirements of the industry. At present, the main electrical manufacturing solution providers (EMS) are inclined to adopt full automation to serve customers better and faster. A major challenge for OEM and EMS providers is to package semiconductor components while avoiding product damage.
Molex provides a variety of solutions for current packaging methods to meet the changing needs of the industry. Recently developed surface mount compatible (SMC) connectors are now available for a variety of different packaging methods, suitable for direct use in automated mounting equipment. Molex’s flexibility in manufacturing and excellent engineering quality in packaging enable Molex to develop customized packaging solutions for the majority of OEM / EMS customers to meet their automation needs.
For any product based industry, in order to maintain product quality, precision packaging design is very important. In the connector industry, precision packaging design can provide great convenience for workers and forklift transportation. The advantages of automation include:
·Because of the reduction of manpower input, the risk of personal injury can be reduced
·The automation of packaging process is realized, so as to improve the production speed.
·It helps to reduce the downtime of the machine.
·Increase sales and reduce the total cost of production.
Most of the traditional connector packaging operations include a variety of bags and pallets. Although the packaging and transportation of the joint is relatively simple, there is a risk of damage during transportation, and in the customer’s facilities, the downtime during the assembly process will also be extended. Some new packaging methods are faster, easier to operate, and can be configured according to the needs of different customers, and can provide assistance for different automation technologies. Here are some common advanced packaging methods:
1. Tape packaging
This packaging process is mainly used for surface mount equipment, loading the connector into each packaging bag inside the packaging tape or conveyor belt. In the winding method, the connector is placed in precisely designed bags which are pressed on the plastic conveyor belt. The upper sealing belt seals on the conveyor belt to protect these components in the correct position. A row of positioning holes are provided along one edge of the embossed tape to facilitate forward indexing.
2. Tray packaging
Palletized packaging can provide safe storage and transportation for larger parts that are not suitable for tape packaging. In bulk packaging, the connectors are loosely placed together in the packaging bag or box. Compared with it, the pallet packaging adopts a unique design, which is often used to improve the safety in the transportation process. Tray packaging can also provide a more efficient way to place on the printed circuit board.
3. Hard tray
Thermoforming pallet is not suitable for some situations because of its low durability, which will cause pallet damage. Sometimes soft pallets may not be able to withstand the weight of the picking and placing arms. In this case, injection molded hard trays are used. This packaging method will increase the manufacturing cost and is only recommended when the soft tray is invalid.
4. Tube packaging
The hollow cylindrical packaging container made of paperboard, plastic or aluminum is called tubular container. Tube packaging is similar to tape winding method, which is suitable for the safe storage and transportation of larger parts that are not completely suitable for tape winding. According to this method, groups of components are placed in pipes isolated from the environment.
In the manufacturing field including automobile, electronic consumer goods, medical devices and industrial automation, the demand for electronic components is increasing day by day. Therefore, it is expected that this will greatly promote the growth of the market in the near future.
In addition, there is a growing preference for electric vehicles in major economies, including Germany and China, which is expected to drive demand for passive components and thus market growth due to the emphasis on harmful emissions.
Molex offers a variety of different packaging methods, such as antistatic bulk packaging, tube packaging, tray packaging, and tape version packaging, which can help automation and reduce costs. This can help electronic component manufacturers around the world to obtain the required components in a suitable packaging way, thus simplifying the assembly process.
As an authorized distributor of MOLEX, heilind can provide relevant services and support for the market. In addition, heilind also supplies products from many of the world’s top manufacturers, covering 25 different component categories. It attaches importance to all market segments and all customers, and constantly seeks a wide range of product supply to cover all markets.