The MLX 75026 provides the same performance as the VGA 3D TOF camera sensor IC MLX 75027, but with half the size reduction.
On September 18, 2020, melexis, a global Microelectronic Engineering Company in tysendero, Belgium, announced the launch of a QVGA time of flight sensor IC — MLX 75026, which has passed the aec-q100 certification. The product is now in mass production. MLX 75026 is the third generation of melexis QVGA TOF chip, which further expands the product portfolio.
In terms of quantum efficiency and distance accuracy, the performance of MLX 75026 is twice that of the previous generation of TOF sensor IC. In addition, MLX 75026 has software compatibility with the third generation VGA TOF sensor IC MLX 75027, which can easily realize VGA and qvga resolution migration. The size of the new sensor IC is reduced by half, but the computing power required is only 30% of that of the VGA TOF sensor IC MLX 75027.
This fully integrated solution is ideal for automotive applications such as driver monitoring system (DMS), hand movement and reliable gesture recognition (HMI) and in car monitoring system (IMS). Low contrast and strong sunlight usually bring severe challenges to the traditional 2D image sensor IC, and the new sensor IC has excellent robustness in this respect. MLX 75026 is ideal for applications where data reliability and availability are critical. The chip is also available for other markets and applications with adequate qvga resolution, including reliable population statistics and object / obstacle detection.
The MLX 75026 has QVGA (320×240 pixels) resolution, uses a 1 / 4-inch optical format, and supports 850 nm and 940 nm lighting. The IC can be configured through I2C interface to provide csi-2 serial data output. The chip has the characteristics of small size, simple power requirements, very low power consumption and small number of external components on PCB. It can be used to design compact and economical TOF camera.
Samples are now available and evaluation kits are available in November 2020.