April 16, 2020 – mouser electronics, an electronic component distributor focusing on introducing new products and promoting industrial innovation, will now sell the new generation of ultra-low power smart sensors bhi260ab and bha260ab of Bosch sensortec. These two products are designed for wearable devices, smart headphones, AR / VR devices and sensors working continuously in smart phones. They integrate a powerful coprocessor, which can share the pressure of the main processor to process sensor data, so as to reduce power consumption and prolong battery life.

Among the two Bosch sensortec smart sensors distributed by maize, bha260ab integrates advanced three-axis MEMS accelerometer, while bhi260ab integrates the same advanced six axis gyroscope / accelerometer inertial measurement unit. Both products integrate Bosch sensorec’s fuser2 kernel, a 32-bit floating-point microcontroller with 256Kb on-chip SRAM. In the energy-efficient 20MHz long-time operation mode, the configurable fuser2 core current is only 950 µ a, while in the high-performance 50MHz acceleration mode, the current is 2.8ma.

Bhi260ab can provide up to 25 general purpose input / output (GPIO), while bha260ab can provide up to 12 GPIO. They all come with SPI or high-speed I ² C host interface, the data rate of both configurations can be as high as 3.4mbit/s, which can realize more energy-saving data transmission. Both sensors also support integration with other sensor devices such as GNSS and various localization systems.

In addition, MAOZe also provides corresponding shuttle boards for these two sensors, namely bhi260ab shuttle board and bha260ab shuttle board. Both products have a variety of external sensors, which can be connected to bhi260ab and bha260ab sensors through jumpers on the PCB board. With the shuttle board, the pins of various sensors can be easily accessed through a simple socket, and the shuttle board can also be inserted into the Bosch sensortec application board.

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