Jiejie Microelectronics' six-inch wafer yield rate is as high as 97.79%
On March 31, Jiejie Microelectronics issued a document saying that the construction project of "Power Semiconductor Six-inch Wafer and Device Packaging and Testing Production Line" undertaken by its subsidiary Jiejie Semiconductor Co., Ltd. Production capacity, the first batch of 6-inch wafers with high surge protection capability will be rolled off the production line on March 26, 2022, with a yield rate of 97.79%.
After the project is put into production, the industrialization capacity of 1 million six-inch wafers per year and 10 billion device packaging and testing per year can be achieved.
Intel's EUV lithography fab has just begun construction
TSMC and Samsung have begun to use EUV to manufacture chips for customers more than two years ago, including HiSilicon, Qualcomm, Apple, AMD, Nvidia, etc.
Intel, the EUV lithography machine fab has only just begun to build, and the chips currently produced, including the Corei9-12900KS, which is known as the world's fastest desktop processor launched a few days ago, are still produced by non-EUV equipment.
According to Intel's roadmap, by the end of 2022, Intel should add Intel 4 nodes, then Intel 3 nodes in 2023, and Intel 20A and 18A nodes in 2024. All of these are EUV-based nodes, and by the end of 2024 Intel will rarely use non-EUV-based microprocessor production processes, as their 7nm/10nm non-EUV nodes will be n-4/n-5 generation processes.
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Editor: Huang Fei