The Honor 50 series is the first digital series after Honor’s independence, and the difficulties it faces are conceivable. The success of the first sale of the Honor 50 series also proves that Honor’s appeal is still there. It is also inevitable for eWisetech to disassemble the Honor 50 without the Kirin chip. So what kind of answer will the high-selling Honor 50 series present to you after being dismantled?

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The dismantling this time is the 8GB + 128GB version. The dismantling equipment was purchased from the e-commerce platform, and the dismantling analysis content in this article is based on this equipment.


Shut down and take out the card tray, the card tray is covered with a silicone ring. The back cover and the inner support are fixed by glue, heated by a hot air gun, and then opened with a suction cup and a pick. A graphite sheet is attached to the position of the back cover corresponding to the NFC coil for heat dissipation. The camera cover is fixed on the back cover by glue, and the front is covered with foam to protect the lens.

The top motherboard cover and bottom speaker are secured with screws. Graphite sheets are attached to the motherboard cover and speakers, and the graphite sheets extend to the battery position, which is conducive to heat dissipation. There are glue-fixed NFC coils and flash boards on the motherboard cover. Then remove the shrapnel plate on the speaker. Note that the rear camera module is secured by a plastic frame.

Remove the main board, sub board, front and rear camera modules and coaxial cables. The processor & memory positions on the front of the motherboard are coated with thermal grease for heat dissipation, and the USB interface of the sub-board is also covered with a silicone sleeve to prevent dust to a certain extent.

The battery is secured with plastic tape. It can be disassembled according to the instructions of the lifting handle. Then remove the key soft board, the sensor board, the main and sub board connection soft board, the earpiece and the fingerprint recognition sensor soft board in turn.

6.57The 1-inch Visionox OLED screen and the inner support are fixed by glue, the glue area is large, the screen is heated, and the screen is opened by opening picks and suction cups. There is a large area of ​​graphite sheets on the front of the inner support, and no liquid cooling tubes are found.

Disassembly summary:The whole Honor 50 is fixed with a total of 23 screws and adopts a relatively common three-stage structure. The difficulty of dismantling is medium, and the reducibility is strong. The SIM card tray and the USB interface are protected by a silicone ring, which can play a certain dust-proof role. The whole machine adopts the method of thermal conductive silicone grease + graphite for heat dissipation, and no liquid cooling tube is found, which is lacking in heat dissipation.


EEarlier in the analysis column, it was mentioned that with the advent of the 5G era, the entry of more and more domestic chip manufacturers has broken the situation of foreign monopoly. What other domestic chips can we find in the Honor 50 that lacks the Kirin chip? First, let’s take a look at the IC marked on the motherboard.

Main IC on the front of the motherboard:

1: Qualcomm-QPM5541-RF power amplifier chip

2: Qualcomm-QPM5577-RF power amplifier chip

3: TI-BQ25970-fast charging chip

4: Qualcomm-WCD9370-audio codec chip

5: Qualcomm-SM7325-Qualcomm Snapdragon 778G processor chip

6: Micron-8GB memory + 128GB flash memory chip

7: Qualcomm-PM7325B-power management chip

8: Qualcomm-WCN6750-WiFi/BT chip

Main IC on the back of the motherboard:

1: NXP-SN100T-NFC control chip

2: Qualcomm-PM7350C-power management chip

3:Qualcomm- PM7325-power management chip

4:Qualcomm- SDR735-RF transceiver chip

5:Qualcomm- QDM3301-RF front-end module chip

6: Qualcomm-QFM2340-RF front-end module core

7: OnMicro-OM9902-11-RF power amplifier chip

8: OnMicro-OM9901-11-RF power amplifier chip

Through the motherboard labeling, we can find that this Honor 50 does not use Kirin chips. In the RF chip, in addition to the Qualcomm that is matched with the processor,There are also two RF power amplifier chips from the domestic manufacturer Onray Micro – OM9901-11 and OM9902-11.

OM9901-11Designed for 2G frequency band, low frequency band supports GSM850/EGSM900, high frequency band supports DCS1800/PCS1900 frequency band. OM9902-11 supports 3G/4G/5G NR frequency bands.

This is the first time that eWiseTech engineers have found the manufacturer’s chip in a mobile phone.OM9901 and OM9902 are 5G Sub-3GHz Phase5N solutions launched by Onray Micro in 2020. Onray Micro has a complete series of PA/FEM product lines, and its products cover the full range of 2G, 3G, 4G, 5G Phase5N, L-PAMID and L-PAMIF.And it is also the first domestic manufacturer to have mass-produced CMOS PA and GaAs PA technologies at the same time.

As early as the end of 2020, OnMicro’s Phase5N RF front-end module has been mass-produced in many mobile phone manufacturers and ODM solution providers.The adoption of the Honor 50 is the first time that Onray Micro has entered the supply chain of Honor. Domestic manufacturers supply best-selling models such as the Honor 50, which also proves that its strength should not be underestimated.

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