Infineon Technology Co., Ltd. demonstrated the fourth generation real3 image sensor irs2771c at the 2019 world mobile communication conference in Barcelona, Spain. The 3D time of flight (TOF) single chip device is designed to meet the needs of the mobile consumer terminal market, especially to support higher resolution with small lenses. A wide range of applications include secure user authentication (such as face recognition or hand recognition) to unlock devices and confirm payments. In addition, this 3D TOF chip helps to improve augmented reality technology, image deformation technology and photo (such as bokeh) effects, and can be used to scan rooms.
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The size of this image sensor is only 4.6 x 5 mm, and the output of 150 K (448 x 336) pixels is close to the standard resolution of HVGA. This makes its resolution four times higher than that of most TOF solutions on the market today. Its pixel array is highly sensitive to 940 nm infrared light and can bring unparalleled outdoor performance. This is achieved by a patented “background illumination suppression” (SBI) circuit at each pixel. Due to its high integration, each irs2771c image sensor is almost a micro monolithic TOF camera. This greatly reduces the bill of materials cost and the actual size of the camera module without affecting performance and minimizing power consumption.
Market leading durability and energy saving advantages
Philipp von schierstaedt, vice president and head of RF and sensor business of Infineon, said: “The durability and energy-saving advantages of this image sensor in ambient light make it an unmatched product in the market. Infineon can further strengthen its leading position with the new generation of image sensors. Each terminal manufacturer can enhance the value of its terminal through the new real3 chip, customize relevant designs and accelerate the pace of bringing products to the market.”
Through long-term cooperation with pmdtechnologies, Infineon has gained in-depth knowledge in processing 3D point cloud algorithm (a set of spatial data points generated by 3D scanning). Therefore, in addition to Infineon’s hardware expertise, customers can also obtain comprehensive services including tools and software. Bernd Buxbaum, CEO of pmdtechnologies, said: “The fruitful cooperation fully proves that the first-class 3D TOF system can be realized only by designing the depth sensing system from scratch, including cutting-edge TOF pixels, image sensors, module design, advanced signal processing and other links. Our customers can take advantage of PMD’s rich experience in developing and manufacturing first-class 3D TOF products for up to 15 years.”
Infineon’s new 3D image sensor chip is developed in Graz, Dresden and Siegen, fully integrating the expertise of Infineon’s German factory and Austria. Samples of this chip will be available in March and mass production is planned to begin in the fourth quarter of 2019. For more information about Infineon 3D image sensor product series and the company’s product display at the 2019 world mobile communication conference, please visit: and.