Huawei mate 30 5g and mate 30 Pro 5g started shipping in China on November 1. Recently, techinsights, a professional dismantling organization, dismantled Huawei mate 30 Pro 5g, model: lio-an00, 8 GB ram + 256 GB ROM.

 

Huawei mate 30 series is the company’s flagship smartphone of the year, which was released in Munich on September 19, 2019. They use Hisilicon Kirin 990 5g SOC, integrate application processor and 5g / 4G / 3G / 2G modem into one component, and are manufactured by TSMC’s second generation 7Nm FinFET EUV (N7 +) process technology.





 

 

Hisilicon hi6421 power management IC

Hisilicon hi6422 power management IC

NXP pn80t safety NFC module

STMicroelectronics bwl68 wireless charging receiver IC

Halo micro hl1506 battery management IC

 





Halo micro hl1506 battery management IC

Hisilicon hi6405 audio codec

Stmp03 (unknown)

Silicon Mitus sm3010 power management IC (possible)

Cirrus logic cs35l36a audio amplifier

MediaTek mt6303 envelope tracker IC

Hisilicon hi656211 power management IC

HiSilicon Hi6H11 LNA/ RF

Front end module of Murata

Hisilicon hi6d22 front end module

PoP(HiSilicon Kirin 990 5G SoC和SK Hynix H9HKNNNFBMAU-DRNEH 8 GB移动LPDDR4X SDRAM)

KKLUEG8UHDB-C2D1 256 GB UFS

Ti ts5mp646 Mipi switch

Ti ts5mp646 Mipi switch

Hiicon Hi1103 Wi-Fi

HiSilicon Hi6H12 LNA/ RF

Cirrus logic cs35l36a audio amplifier

Hisilicon hi6d03 MB / HB power amplifier module

 



Hisilicon hi6365 RF transceiver

Unknown 429 power amplifier (possible)

HiSilicon Hi6H12 LNA/ RF

Qualcomm qdm2305 front end module

HiSilicon Hi6H11 LNA/ RF

HiSilicon Hi6H12 LNA/ RF

Hisilicon hi6d05 power amplifier module

Front end module of Murata

Unknown 429 power amplifier (possible)

 

Kirin 990 5g: 5g application processor / modem

In addition to Huawei mate 30 5g and mate 30 Pro 5g, all 5g mobile phones in the world, no matter what power they are powered by (Qualcomm snapdragon, Samsung exynos or Hisilicon Kirin), have independent 5g modems, which can be paired with traditional 4G AP / modems. Kirin 9905g is the first 5g SOC. The device integrates an integrated application processor and 5g / 4G / 3G / 2G modem in a single component.

 

Kirin 9905g in our mobile phone is a package package (POP), which includes Kirin 9905g SOC chip and SK Hynix h9hknnnfbmau-drneh 8 GB mobile lpddr4x SDRAM, the same as DRAM we see in Huawei mate 20x (5g).

 





The chip size of Kirin 9905g SOC is 10.68mm x 10.61mm = 113.31mm ㎡. In contrast, the chip size of mate 20 x (5g), Kirin 980 4G AP / modem is 8.25mm x 9.16mm = 75.57mm 2, while the chip size of independent 5g modem Balong 5000 is 9.82mm x 8.74mm = 85.83mm 2. Kirin 980 4G AP / modem chip size + 5g Balong modem chip size = 161.4mm ㎡. The bare chip size of Kirin 9905g SOC is 113.31mm 2, which is much smaller than the previous two component solution.

 

In this disassembly, we can see that the power supply, audio, RF, RF transceiver, SOC, etc. are all self-developed chips of Huawei, accounting for about half of them! This shows that Huawei has strengthened the self-development of chips in its smart phones and accelerated the replacement of foreign devices.

 

Hisilicon hi6421 power management IC

 

Hisilicon hi6422 power management IC

 

Hisilicon hi6405 audio codec

 

Hisilicon hi656211 power management IC

 

Haisi hi6h11 LNA / RF switch

 

Hisilicon hi6d22 front end module

 

Hisilicon 990 5g SOC

 

Hisilicon hi1103 Wi Fi / BT / GNSS wireless combination IC

 

Haisi hi6h12 LNA / RF switch

 

Hisilicon hi6d03 MB / HB power amplifier module

 

Hisilicon hi6365 RF transceiver

 

Haisi hi6h12 LNA / RF switch

 

Haisi hi6h11 LNA / RF switch

 

Hisilicon hi6d05 power amplifier module

 

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