Fujitsu Microelectronics Co., Ltd. today announced the launch of two new consumer FCRAM memory chips – 512 MB (mb81eds516545) and 256 MB (mb81eds256545). These two chips support DDR SDRAM interface and are the first chips in the industry to expand the operating temperature range to 125 ° C. Fujitsu Microelectronics began to provide these two new FCRAM products today. These two low-power memories are suitable for system level package (SIP) of digital TV, digital video camera and other consumer electronic products.

If the system on chip (SOC) of SIP architecture integrates the new FCRAM chip, the memory will not affect or restrict the operation when the operating temperature rises due to the increase of SIP operating speed, and customers will benefit from it. In addition, it also has other advantages, such as reducing the difficulty of product design and development, saving circuit board space, and reducing the number of components.

At present, the market has higher and higher requirements for the performance, speed and development cost of consumer digital products. In order to meet these requirements, SIP will be used more, and it is required to integrate memory chips with SOC at the same time. The use of SIP can reduce the number of components and save circuit board space, thus reducing the cost of the system. SIP can also simplify the development of high-speed memory or take noise reduction measures.

Fujitsu Microelectronics promotes two new consumer FCRAM memory chips

It shows the advantages of using new FCRAM

As shown in Figure 1, so far, with traditional memory, SIP is limited, and the new FCRAM product can solve this problem. The high performance SOC used in the SIP architecture described in Figure 1 (a) has high power consumption, and the heat generated can make the SIP temperature rise to 105 degrees. Because the highest temperature of SOC is rated at 125 degrees, the operation can be carried out normally. However, the traditional memory can only operate at the highest temperature of 95 degrees, so this SIP architecture cannot be used.

Another way to use traditional memory on SIP is to add heat sink. As shown in Figure 1 (b), this scheme can reduce the SIP temperature to 90 degrees, and the device can operate, but it increases the cost and the occupied area of the circuit board. Therefore, many customers who have been studying SIP hope to expand the working temperature range of memory.

In response to this demand, Fujitsu Microelectronics has developed 512 MB and 256 MB consumer FCRAM products with a maximum operating temperature of 125 ℃. As shown in 1 (c), with the rated 125 degree FCRAM, SIP can operate well even if a high-power SOC is integrated, without adding heat sink. This solves the problem of cost increase caused by adopting heat dissipation measures when using traditional memory rated at 95 degrees.

Moreover, these new FCRAM products can provide twice the data transfer rate of traditional DDR SDRAM memory even when operating at 125 degrees, while maintaining low power consumption. In fact, compared with the traditional DDR2 SDRAM, the new 512 MB FCRAM can reduce the power consumption by 50%. Therefore, these new FCRAM can reduce the carbon dioxide emission of the memory of consumer electronic products by 50%.

Fujitsu Microelectronics will continue to develop products with necessary performance and function for SIP, so as to provide the best value and cost solution for consumer electronic products.

Sample supply

Sales target

One million tablets are sold every month

Product features

1. The industry’s first chip operating at 125 degrees

The maximum operating temperature of these new FCRAM is 125 degrees. Compared with the traditional SDRAM with the maximum temperature of 85 degrees or 95 degrees, the allowable power consumption of the system is increased. Therefore, SIP solution can be realized, which was not possible before. For example, if memory is integrated into high-power SOC for high-performance digital consumer electronics, the device will overheat. And the product can use low-cost packaging, without high-temperature specifications.

2. Low power consumption

By expanding the bus width to 64 bit, reducing the operating frequency and using terminal resistance (* 2), compared with two traditional DDR2 SDRAM chips with 16 bit bus width, the new FCRAM can reduce the power consumption by up to 50%. These new types of FCRAM can reduce the carbon dioxide emission of the memory of consumer electronic products by 50%.

3. High speed data bandwidth

When the operating temperature is 125 degrees, the new FCRAM can provide 3.2 gbgs data transfer rate by using 64 bit bus width and operating at the maximum operating frequency of 200 MHz, which is twice the speed of the traditional DDR2 SDRAM. If the working temperature is not higher than 105 degrees (≤ 105 ° C), the data transmission rate of the product will increase to 3.46 GB / s at 216 MHz.

Editor in charge ajx

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