With the function of electronic products becoming more and more complex, the power consumption is increasing; the heat generated by the system is also increasing, while the integration density of PCB is increasing. According to relevant data, the area of PCB has been reduced by half, while the integrated components on the board have increased by 3.5 times, and the integrated density of the whole PCB has increased by 7 times. PCB board and system are developing towards higher density, faster speed and higher calorific value. In addition, more and more attention has been paid to the problems caused by the overheating of circuit boards. Thermal simulation will become an indispensable step in the process of electronic design. The traditional thermal simulation test is mainly carried out in the product design verification stage, and there is no good connection between MDA and EDA. Recently, mentor graphics company launched an electronic heat dissipation solution flothermxt, which can cover from conceptual design stage to design verification stage. Flothermxt supports thermal simulation test in all design stages. It is the first solution combining mda-eda electronic heat dissipation simulation, which can significantly shorten the process time from concept to detailed design.
Applied to the whole design phase
As shown in Figure 1, taking the design of a tp link as an example, Flotherm XT can help engineers carry out electronic heat dissipation simulation at any time from the conceptual design stage to the design verification stage. In the product conceptual design stage, engineers can directly establish or import the required components from the existing software library for the initial PCB conceptual layout, and then place the external chassis, and observe the location and direction of the placement from different angles, as well as the size and thickness of the components that may affect the system heating parameters; at this time, the system thermal simulation test can be carried out to observe the parameters on the PCB For the heating condition of the components, if there is overheating condition, the design shall be modified, such as adding ventilation holes or heat sinks, and the air flow after the design change shall be observed to see whether it meets the heat dissipation requirements of the system. After entering the actual design, engineers can directly import the completed design from EDA design tools, and import Flotherm XT for PCB thermal simulation analysis after simplification (filtering non heating devices). At the same time, thermal analysis and adjustment of components can also be carried out. Finally, the MDA shell is imported, and the thermal simulation of the whole design is carried out in the simulation application environment. After meeting the design requirements, the specific simulation result report is exported.
Shorten process time
In addition to mda-eda, which can provide a complete electronic cooling simulation solution from conceptual design stage to design verification stage, floth ermxt optimized electronic cooling process greatly saves running time compared with the traditional process. The traditional method of cooperating with EDA / MDA is complex and time-consuming. The specific flow chart is shown in Figure 2 (a) When importing Da, it is necessary to simplify, export CAD and clean up geometry first, and then divide assembly model and network, solve, post-processing and report generation. Generally, the network division and solution (batch processing) steps are not easy to succeed, and the previous steps need to be repeated when they fail, which leads to long running time. When importing from EDA, the meshing step also faces the same problem. The repeated verification process will lead to the waste of design time. As shown in Figure 2 (b), the EDA / MDA optimized by Flotherm XT can greatly shorten the time of design process. When importing from MDA, additional details can be filtered directly. The filter of Flotherm XT can also be set with automatic memory, which can greatly save the time of assembly model and network partition. It can also refer to the original file and automatic memory content. When importing from EDA, through the floeda interface, the processing steps are greatly saved and the running time is shortened.
Figure 2 (b): Flotherm XT optimizes the collaborative workflow with EDA / MDA.
Flotherm XT applications
FloTHERM XT changes the original way that the simulation test can only be carried out after the completion of the design. It supports the simulation from the concept stage and runs through the whole design process. The iterative steps in the later design process are less, which can verify or eliminate the experimental changes faster. Through more “hypothesis analysis”, it can obtain more competitive products and reduce the dependence on thermal experts, The gap between EDA and MDA is narrowed to help customers develop more competitive and reliable products and achieve shorter time to market. It is widely used in the fields of router for telecommunication, computer graphics card, pump controller in automobile, smart phone, medical treatment, aviation, etc. it can help customers improve the efficiency of design and improve the reliability of products.