Since Intel launched the A39X0 series of central control car SoCs in 2016, BMW has been Intel’s most loyal customer, and all BMW series are Intel A3960. Intel’s other customers include GM, Volvo, Subaru, Hyundai Kia, FCA, Great Wall, Chery, and Hongqi. However, Intel’s product line is too long. Since the launch of the first-generation product in 2016, it has not had the energy to plan for the second-generation product, which is tantamount to giving up the market on its own initiative. Maybe Intel doesn’t like the car cockpit market, after all, compared with PC, the volume is too low. Customers like Intel have no choice but to switch to Qualcomm. The high-end cockpit market is dominated by Qualcomm, but as long as they are willing, MediaTek, Samsung, and Nvidia are all capable of challenging Qualcomm. It was originally expected that BMW would not switch to Qualcomm chips until 2023 or 2024, but BMW has already begun to switch to Qualcomm chips in 2022.

The new Qualcomm platform has also introduced a new supplier, that is Garmin, whose main product is a portable GPS navigation device used on bicycles or yachts. The penetration rate of smartphones in Europe is not high, and there is still a market for portable navigation. Samsung Harman is also the main supplier, and the Chinese market is supplied by Samsung Harman. Alpine, the original main supplier, has not yet seen related products. The model number is MGU22, and 22 means that it will be available from 2022. Samsung Harman may supply a high-end model, the model is MGU22H.

Construction machine without label, top view

The bottom plate has a large number of cooling holes

MGU22 is relatively thin, with only one motherboard and one core board. The radio and audio power amplification part is placed separately in another box, which is RAM, connected via Ethernet. Compared with the previous generation of MGU, the biggest change of MGU22 is that the SoC has changed from Intel A3960 to Qualcomm SA8155P, and the MCU has also been changed. The previous generation is Renesas RH850 series, model R7F7010553. The new generation of MGU is replaced by Cypress, which is Infineon’s MCU, TRAVEO T2G series, model CYT2B98CACQ0AZEG. The reason for switching to Infineon’s MCU is presumably because of the cost. The RH850’s tool chain and peripherals are relatively expensive. Renesas still sticks to its own core architecture like RL78 or G3K, rather than the mainstream ARM Cortex-M series or R series. The advantage of Renesas is that the built-in Flash capacity is relatively high, the reliability is relatively high, and the ASIL-D level can be easily achieved. Of course, the disadvantage of its own kernel architecture is that it is relatively closed and requires a lot of assistance from the original factory. TRAVEO T2G series is a 40nm process, dual CPU system, one is 160-MHz 32-bit Arm Cortex-M4F, also comes with a simple single-precision floating-point unit FPU, one is 100-MHz 32-bit Arm Cortex M0. Contains 2112KB of Code Flash. Especially for FOTA upgrade, it provides single-ended or double-ended Bank mode. Functional safety reaches ASIL-B level.

Close-up of Qualcomm SA8155P, including two pieces of Micron’s 8GB LPDDR4 and two pieces of PMM8155AU. The power management of SA8155P is complex and requires two PMM8155AU chips. Usually, only one chip is needed for SoC power management. In the future, the fourth-generation SA8295P needs three chips, mainly for functional safety and power system backup. Another Samsung UFS is independent of the core board.

The largest chip in the middle is Marvell’s Ethernet switch 88Q5050, and Drive Pegasus, Nvidia’s previous flagship self-driving platform, is also useful. There are two chips on the left, one is the 100M Ethernet physical layer, which may be Marvell’s 88EA1512, and the other is the Gigabit Ethernet physical layer, which may be Broadcom.

88Q5050 is an 8-port Ethernet Gigabit switch with 4 fixed 100BASE-T1 ports (supporting the latest TSN, namely IEEE 802.3bw standard), and can switch from 100BASE-T1, 100BASE-TX, 2 MII/RMII/RGMII, 1 GMII and 1 SGMII port with a configurable selection of four additional ports. Integrated ARM Cortex-M7 CPU, 250 MHz. The bottom row of chips, from left to right, is the image input deserialization chip of Texas Instruments, the image output deserialization chip of Inova, the USB HUB chip of Texas Instruments, and the BT/WLAN chip of NXP. The full name of the APIX interface is AutomoTIve PixelLink, which is mainly promoted by the German company Inova. It has been developed to the third generation and is called the APIX3 interface standard. The maximum bandwidth can reach 12Gbps (two-channel transmission), and it is currently the interface with the highest serial rate support. Standard, a single lane can transmit up to 3840×[email protected], 24bpp original image. Similar to Maxim’s GMSL and Texas Instruments’ FPDLINK, BMW may have invested in it. BMW’s entire series uses APIX technology and is Inova’s main customer. Jaguar, Volkswagen and Volvo also use some models.

Backplane diagram

From left to right, there are BT/WLAN antennas, 3 USB 3.0 ports, one is the central control panel interface, one AR navigation camera interface, one Fast Ethernet interface, one Gigabit Ethernet interface, and GPS antenna interface.

2021 MGU Backplane

It can be seen that two USB ports have been added, and the rest are the same.

Intel has given up the market this time, and it will be difficult to come back. Customers need a long-term and stable strategic plan, not just the products in front of them.

Editor: Huang Fei

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